“Semiconductor dicing requires high speed, accurate rotation with minimal vibration to achieve technology-demanded cut quality. ABD ensures high precision air-bearing spindles are designed and manufactured to exacting standards.”
DICING
Dicing is the process of cutting a fully processed semiconductor wafer into individual dies (chips).
It’s one of the final steps before packaging and is critical for yield, reliability, and cost.
After wafer fabrication (lithography, etching, deposition, etc.), the wafer contains hundreds or thousands of chips arranged in a grid. These must be separated (diced) cleanly without damaging them.
ABD has a range of dicing spindles with differing mounting arrangements, several power outputs, complete with customisable wheelmounts and associated tooling which are all designed and manufactured to exacting standards achieving the highest quality.
“ABD dicing spindles are equipped with direct drive brushless DC motors, with Hall Effect commutation available as required, thus providing low cogging and excellent speed stability.
High speed and high stiffness facilitate industry-leading dicing cutting performance, with a range of customisable hubbed and hubless wheelmounts available with minimal runouts.
Cost of ownership is kept low by reduced bearing CDA consumption, low friction bearings, and high efficiency motors.”
DSA0001 Performance Specs
